Laser cutting machines can cut copper plates, but they need to be reasonably configured according to the thickness of the copper plate, laser power and auxiliary gas type. Thin copper plates (such as less than 1mm) can be cut directly, while thicker copper plates need to be combined with auxiliary gases such as oxygen to improve the cutting effect.
Key factors for laser cutting copper plates
Matching copper plate thickness and power
Thin copper plates (≤1mm): Low-power lasers (such as 3000W) can be cut without auxiliary gas.
Medium thickness (1-4mm): Nitrogen-assisted cutting (such as 6000W) is required, but when it exceeds 4mm, oxygen needs to be used to oxidize the copper surface to improve cutting efficiency.
Thick copper plates (>8mm): High-power lasers (such as 12000W) are required, but the cutting effect may still be inferior to materials such as stainless steel.
Material property challenges
The high reflectivity of copper can easily damage the laser lens, and the cut surface may be rough, so it is necessary to optimize parameters (such as lowering the temperature) or choose alternative processes (such as water jet cutting, wire cutting).
Assist gas selection
Oxygen: Suitable for thick copper plates, it accelerates cutting through oxidation reaction, but may increase edge roughness.
Nitrogen: Used for thin plate cutting, it can reduce oxidation and improve the quality of the cut.
Application suggestions
Industrial scenarios: High-power laser cutting machines (such as 12000W) can handle a variety of metals, but copper plate cutting requires extra attention to maintaining the lens and gas configuration.